TY - JOUR
T1 - CML GAAS 4KB SRAM.
AU - Takahashi, Kazukio
AU - Maeda, Tadashi
AU - Katano, Fumiaki
AU - Furutsuka, Takashi
AU - Higashisaka, Asamitsu
PY - 1985/12/1
Y1 - 1985/12/1
N2 - Summary form only given. A CML-compatible GaAs 4-Kb static RAM has been designed. Source-coupled FET logic was used for the peripheral circuit, because it is suitable for the adjustment of the supply voltages and the input/output levels to the CML level, as well as being able to drive large loads. The memory cell, on the other hand, is composed of conventional E/D-DCFL circuitry. The SRAM was fabricated by using sidewall-assisted closely-spaced-electrode FET technology, where the spacings between source and gate, drain and gate are extremely narrow, to reduce the parasitic series resistances. Separation is by 0. 25- mu m films prepared on both sides of the gate electrode. The device was tested by using both the memory tester and the 50- OMEGA high-speed measurement system and was operable at the CML supply voltage level. Read/write operation was confirmed. The minimum address access time was 2. 4 ns for a power dissipation of 1. 08 W.
AB - Summary form only given. A CML-compatible GaAs 4-Kb static RAM has been designed. Source-coupled FET logic was used for the peripheral circuit, because it is suitable for the adjustment of the supply voltages and the input/output levels to the CML level, as well as being able to drive large loads. The memory cell, on the other hand, is composed of conventional E/D-DCFL circuitry. The SRAM was fabricated by using sidewall-assisted closely-spaced-electrode FET technology, where the spacings between source and gate, drain and gate are extremely narrow, to reduce the parasitic series resistances. Separation is by 0. 25- mu m films prepared on both sides of the gate electrode. The device was tested by using both the memory tester and the 50- OMEGA high-speed measurement system and was operable at the CML supply voltage level. Read/write operation was confirmed. The minimum address access time was 2. 4 ns for a power dissipation of 1. 08 W.
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M3 - Conference article
AN - SCOPUS:0022203552
SN - 0193-6530
SP - 68-69, 308
JO - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
JF - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
ER -