High-speed, high-density CMOS VLSI devices have powerful output buffers to charge a load capacitance quickly, which causes large switching noise on the power/ground lines. Furthermore, the equivalent impedance of the output buffer becomes lower than the characteristic impedance of the transmission line on a board, which induces complicated phenomena, including ringing noise. These problems are discussed, and the electrical characteristics of a 348-pin QFP (quad flat package) developed for a 1-micron, 129-K gate CMOS gate array is described. The factors that determine switching noise were investigated by a simulation that represents the packaging environment. A test chip for evaluating the switching noise was designed and used to characterize the 348-pin QFP. Disagreement between measured data and simulation results remains to be investigated.
|ジャーナル||Proceedings - Electronic Components and Technology Conference|
|出版ステータス||Published - 1989|
|イベント||39th Electronic Components - Houston, TX, USA|
継続期間: 1989 5月 22 → 1989 5月 24
ASJC Scopus subject areas