Considerations on package design for high speed and high pin count CMOS devices

Toshio Sudo, Toshiaki Mori, Takashi Yoshimori

研究成果: Conference article査読

5 被引用数 (Scopus)


High-speed, high-density CMOS VLSI devices have powerful output buffers to charge a load capacitance quickly, which causes large switching noise on the power/ground lines. Furthermore, the equivalent impedance of the output buffer becomes lower than the characteristic impedance of the transmission line on a board, which induces complicated phenomena, including ringing noise. These problems are discussed, and the electrical characteristics of a 348-pin QFP (quad flat package) developed for a 1-micron, 129-K gate CMOS gate array is described. The factors that determine switching noise were investigated by a simulation that represents the packaging environment. A test chip for evaluating the switching noise was designed and used to characterize the 348-pin QFP. Disagreement between measured data and simulation results remains to be investigated.

ジャーナルProceedings - Electronic Components and Technology Conference
出版ステータスPublished - 1989
イベント39th Electronic Components - Houston, TX, USA
継続期間: 1989 5月 221989 5月 24

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学


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