TY - GEN
T1 - Correlation of PDN impedance between measurements and simulation of 3D-SiP
AU - Kawaguchi, Shohei
AU - Sato, Masaomi
AU - Takatani, Hiroki
AU - Tanaka, Yosuke
AU - Fujita, Haruya
AU - Suto, Yoichi
AU - Sudo, Toshio
PY - 2013/12/1
Y1 - 2013/12/1
N2 - Recently, ultra-wide bus 3D-SiP with TSV's has attracted great attention to achieve energy-saving and high-performance system level module. TSV technology is a new technology of vertical wiring to make shorter than the conventional wire bonding. However, the power supply integrity and signal integrity has become an issue due to the increase of simultaneous switching output buffers. In this paper, PDN impedances of 3D-SiP were examined by the measurement and simulation. Simulated PDN impedances of three chips were well correlated with the measured results.
AB - Recently, ultra-wide bus 3D-SiP with TSV's has attracted great attention to achieve energy-saving and high-performance system level module. TSV technology is a new technology of vertical wiring to make shorter than the conventional wire bonding. However, the power supply integrity and signal integrity has become an issue due to the increase of simultaneous switching output buffers. In this paper, PDN impedances of 3D-SiP were examined by the measurement and simulation. Simulated PDN impedances of three chips were well correlated with the measured results.
KW - 3D-SiP
KW - measurement
KW - on-die capacitance
KW - power distribution network (PDN)
KW - simultaneous switching noise
KW - ultra-wide bus
UR - http://www.scopus.com/inward/record.url?scp=84894127159&partnerID=8YFLogxK
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U2 - 10.1109/EDAPS.2013.6724413
DO - 10.1109/EDAPS.2013.6724413
M3 - Conference contribution
AN - SCOPUS:84894127159
SN - 9781479923113
T3 - EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium
SP - 158
EP - 161
BT - EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium
T2 - 2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013
Y2 - 12 December 2013 through 15 December 2013
ER -