TY - GEN
T1 - Development of MEMS pierce-type nanocrystalline Si electron-emitter array for massively parallel electron beam direct writing
AU - Nishino, Hitoshi
AU - Yoshida, Shinya
AU - Kojima, Akira
AU - Ikegami, Naokatsu
AU - Koshida, Nobuyoshi
AU - Tanaka, Shuji
AU - Esashi, Masayoshi
PY - 2014
Y1 - 2014
N2 - This paper mainly reports the process development of a Pierce-type nanocrystalline Si (nc-Si) electron emitter array for massively parallel electron beam (EB) lithography based on active-matrix operation using a large-scaled integrated circuit (LSI). The emitter array consists of 100×100 hemispherical emitters formed by isotropic wet etching of Si. EB resist patterning was demonstrated by 1:1 projection exposure using a discrete emitter array at CMOS-compatible operation voltages. To independently control each emitter using the LSI, isolation trenches filled with benzocyclobutene (BCB) were fabricated in the Si substrate. In addition, the integration process of the emitter array, the LSI and an extraction electrode plate was developed based on Au-In and polymer bonding technologies.
AB - This paper mainly reports the process development of a Pierce-type nanocrystalline Si (nc-Si) electron emitter array for massively parallel electron beam (EB) lithography based on active-matrix operation using a large-scaled integrated circuit (LSI). The emitter array consists of 100×100 hemispherical emitters formed by isotropic wet etching of Si. EB resist patterning was demonstrated by 1:1 projection exposure using a discrete emitter array at CMOS-compatible operation voltages. To independently control each emitter using the LSI, isolation trenches filled with benzocyclobutene (BCB) were fabricated in the Si substrate. In addition, the integration process of the emitter array, the LSI and an extraction electrode plate was developed based on Au-In and polymer bonding technologies.
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U2 - 10.1109/MEMSYS.2014.6765678
DO - 10.1109/MEMSYS.2014.6765678
M3 - Conference contribution
AN - SCOPUS:84898958178
SN - 9781479935086
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 467
EP - 470
BT - MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014
Y2 - 26 January 2014 through 30 January 2014
ER -