Editor’s Message to Special Issue on Embedded Systems Engineering

研究成果: Editorial › 査読

本文言語	English
ページ（範囲）	140
ページ数	1
ジャーナル	Journal of information processing
巻	30
DOI	https://doi.org/10.2197/ipsjjip.30.140
出版ステータス	Published - 2022

ASJC Scopus subject areas

@article{47a94c6ff87e4822879a22adb6eba9b0,

title = "Editor{\textquoteright}s Message to Special Issue on Embedded Systems Engineering",

author = "Kenji Hisazumi",

year = "2022",

doi = "10.2197/ipsjjip.30.140",

language = "English",

volume = "30",

pages = "140",

journal = "Journal of information processing",

issn = "0387-5806",

publisher = "Information Processing Society of Japan",

}

TY - JOUR

T1 - Editor’s Message to Special Issue on Embedded Systems Engineering

AU - Hisazumi, Kenji

PY - 2022

Y1 - 2022

UR - http://www.scopus.com/inward/record.url?scp=85125066994&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85125066994&partnerID=8YFLogxK

U2 - 10.2197/ipsjjip.30.140

DO - 10.2197/ipsjjip.30.140

M3 - Editorial

AN - SCOPUS:85125066994

SN - 0387-5806

VL - 30

SP - 140

JO - Journal of information processing

JF - Journal of information processing

ER -