Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints

Takayuki Kobayashi; Yoshiharu Kariya; Tsutomu Sasaki; Masamoto Tanaka; Kohei Tatsumi

doi:10.1109/ECTC.2007.373870

Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints

Takayuki Kobayashi, Yoshiharu Kariya, Tsutomu Sasaki, Masamoto Tanaka, Kohei Tatsumi

研究成果: Conference contribution

8 被引用数 (Scopus)

抄録

Effect of Ni addition on the bending properties of Sn-Ag-Cu lead-free solder joints was investigated. Three point bending tests were conducted with a 324pin flip chip specimen at 10 Hz frequency and with 3mm substrate displacement. The test temperatures were 298K and 398K. At each temperature, Sn-1.2Ag-0.5Cu with a small amount of Ni addition, LF35 showed higher performance. The reason LF35 showed higher bending performance was discussed based on a mechanical fatigue test using a micro bulk specimen. Ni addition caused a fine subgrain of β-Sn, hence the crack propagation mechanism is changed, resulting in the improved fatigue performance of LF35.

本文言語	English
ホスト出版物のタイトル	Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
ページ	684-688
ページ数	5
DOI	https://doi.org/10.1109/ECTC.2007.373870
出版ステータス	Published - 2007
イベント	57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States 継続期間: 2007 5月 29 → 2007 6月 1

出版物シリーズ

名前	Proceedings - Electronic Components and Technology Conference
ISSN（印刷版）	0569-5503

Conference

Conference	57th Electronic Components and Technology Conference 2007, ECTC '07
国/地域	United States
City	Sparks, NV
Period	07/5/29 → 07/6/1

ASJC Scopus subject areas

電子材料、光学材料、および磁性材料
電子工学および電気工学

文献へのアクセス

10.1109/ECTC.2007.373870

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引用スタイル

Kobayashi, T, Kariya, Y, Sasaki, T, Tanaka, M & Tatsumi, K 2007, Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints. in Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07., 4249956, Proceedings - Electronic Components and Technology Conference, pp. 684-688, 57th Electronic Components and Technology Conference 2007, ECTC '07, Sparks, NV, United States, 07/5/29. https://doi.org/10.1109/ECTC.2007.373870

@inproceedings{2ba2f2254f00465ebbfa289481d82965,

title = "Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints",

abstract = "Effect of Ni addition on the bending properties of Sn-Ag-Cu lead-free solder joints was investigated. Three point bending tests were conducted with a 324pin flip chip specimen at 10 Hz frequency and with 3mm substrate displacement. The test temperatures were 298K and 398K. At each temperature, Sn-1.2Ag-0.5Cu with a small amount of Ni addition, LF35 showed higher performance. The reason LF35 showed higher bending performance was discussed based on a mechanical fatigue test using a micro bulk specimen. Ni addition caused a fine subgrain of β-Sn, hence the crack propagation mechanism is changed, resulting in the improved fatigue performance of LF35.",

author = "Takayuki Kobayashi and Yoshiharu Kariya and Tsutomu Sasaki and Masamoto Tanaka and Kohei Tatsumi",

year = "2007",

doi = "10.1109/ECTC.2007.373870",

language = "English",

isbn = "1424409853",

series = "Proceedings - Electronic Components and Technology Conference",

pages = "684--688",

booktitle = "Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07",

note = "57th Electronic Components and Technology Conference 2007, ECTC '07 ; Conference date: 29-05-2007 Through 01-06-2007",

}

TY - GEN

T1 - Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints

AU - Kobayashi, Takayuki

AU - Kariya, Yoshiharu

AU - Sasaki, Tsutomu

AU - Tanaka, Masamoto

AU - Tatsumi, Kohei

PY - 2007

Y1 - 2007

N2 - Effect of Ni addition on the bending properties of Sn-Ag-Cu lead-free solder joints was investigated. Three point bending tests were conducted with a 324pin flip chip specimen at 10 Hz frequency and with 3mm substrate displacement. The test temperatures were 298K and 398K. At each temperature, Sn-1.2Ag-0.5Cu with a small amount of Ni addition, LF35 showed higher performance. The reason LF35 showed higher bending performance was discussed based on a mechanical fatigue test using a micro bulk specimen. Ni addition caused a fine subgrain of β-Sn, hence the crack propagation mechanism is changed, resulting in the improved fatigue performance of LF35.

AB - Effect of Ni addition on the bending properties of Sn-Ag-Cu lead-free solder joints was investigated. Three point bending tests were conducted with a 324pin flip chip specimen at 10 Hz frequency and with 3mm substrate displacement. The test temperatures were 298K and 398K. At each temperature, Sn-1.2Ag-0.5Cu with a small amount of Ni addition, LF35 showed higher performance. The reason LF35 showed higher bending performance was discussed based on a mechanical fatigue test using a micro bulk specimen. Ni addition caused a fine subgrain of β-Sn, hence the crack propagation mechanism is changed, resulting in the improved fatigue performance of LF35.

UR - http://www.scopus.com/inward/record.url?scp=35348910719&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=35348910719&partnerID=8YFLogxK

U2 - 10.1109/ECTC.2007.373870

DO - 10.1109/ECTC.2007.373870

M3 - Conference contribution

AN - SCOPUS:35348910719

SN - 1424409853

SN - 9781424409853

T3 - Proceedings - Electronic Components and Technology Conference

SP - 684

EP - 688

BT - Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07

T2 - 57th Electronic Components and Technology Conference 2007, ECTC '07

Y2 - 29 May 2007 through 1 June 2007

ER -

Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints

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出版物シリーズ

Conference

ASJC Scopus subject areas

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