Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip-Chip Interconnects

Physics & Astronomy

• thermal fatigue 84%
• fatigue life 78%
• solders 48%
• silver 47%
• chips 46%
• endurance 17%
• cycles 9%
• crack propagation 7%
• intermetallics 6%
• cracks 5%

Engineering & Materials Science

• Thermal fatigue 71%
• Silver 63%
• Soldering alloys 42%
• Fatigue of materials 40%
• Durability 11%
• Coarsening 8%
• Fatigue testing 8%
• Thermal cycling 8%
• Intermetallics 7%
• Crack propagation 6%
• Cracks 4%

Chemical Compounds

• Thermal Fatigue 100%
• Solder 54%
• Crack Propagation 10%
• Alloy 10%
• Thermal Cycling 9%
• Resistance 9%
• Intermetallic Compound 7%