Effect of specimen size and aging on tensile properties of Sn-Ag-Cu lead-free solders

Physics & Astronomy

• cast alloys 18%
• casts 28%
• eutectic alloys 41%
• eutectics 62%
• homogenizing 16%
• intermetallics 14%
• microstructure 9%
• solders 90%
• tendencies 14%
• tensile properties 90%
• tensile strength 46%

Engineering & Materials Science

• Aging of materials 64%
• Eutectics 85%
• Intermetallics 14%
• Lead-free solders 100%
• Microstructure 9%
• Soldering alloys 39%
• Tensile properties 82%
• Tensile strength 32%

Chemical Compounds

• Alloy 37%
• Eutectics 82%
• Homogenization 15%
• Intermetallic Compound 14%
• Microstructure 9%
• Solder 49%
• Strength 8%
• Tensile Strength 34%