TY - GEN
T1 - Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy
AU - Sato, Takuma
AU - Kariya, Yoshiharu
AU - Fukui, Kazuma
PY - 2013/12/1
Y1 - 2013/12/1
N2 - In this study, the effects of temperature and strain rate on low cycle fatigue life of Bi-Sn eutectic alloys have been studied. The fatigue life improves with the increasing of temperature and the decreasing of strain rate. This is a reverse phenomenon from characteristics found in general metals. As temperature increases and strain rate decreases, grin boundary sliding becomes the dominant deformation mechanism and the fatigue ductility coefficient increases, resulting in an improvement of fatigue life. To the extent of this study, dependence on temperature and strain rate can be expressed by Manson-Coffin's law modified using Z-parameters.
AB - In this study, the effects of temperature and strain rate on low cycle fatigue life of Bi-Sn eutectic alloys have been studied. The fatigue life improves with the increasing of temperature and the decreasing of strain rate. This is a reverse phenomenon from characteristics found in general metals. As temperature increases and strain rate decreases, grin boundary sliding becomes the dominant deformation mechanism and the fatigue ductility coefficient increases, resulting in an improvement of fatigue life. To the extent of this study, dependence on temperature and strain rate can be expressed by Manson-Coffin's law modified using Z-parameters.
UR - http://www.scopus.com/inward/record.url?scp=84894659597&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84894659597&partnerID=8YFLogxK
U2 - 10.1115/IPACK2013-73193
DO - 10.1115/IPACK2013-73193
M3 - Conference contribution
AN - SCOPUS:84894659597
SN - 9780791855751
T3 - ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
BT - ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
T2 - ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Y2 - 16 July 2013 through 18 July 2013
ER -