Effectiveness of Thin-film Barrier Metals for Eutectic Solder Bumps

S. Honma, K. Tateyama, H. Yamada, K. Doi, N. Hirano, T. Okada, H. Aoki, Y. Hiruta, T. Sudo

研究成果: Article査読


This paper describes effective thin-film structure barrier metals for use as eutectic solder bumps. Shear strength and bump interconnection resistance were evaluated. The mutual diffusion in metals was investigated. Barrier metal structures -Cu/Ti, Ni/Ti and Cu/Cr - were evaluated after ageing. The Ni/Ti structure has good reliability according to ageing test results. Pd is used for improvement of solder wettability and as an oxidisation barrier. Consequently, it was concluded that a thin-film Pd/Ni/ Ti barrier metal is suitable for use as eutectic solder bumps. The broken interfaces of the solder bumps were analysed by scanning auger electron spectrometry. In the thin-film Cu/Ti structure, decrease in the shear strength is caused by three mechanisms, as determined from the broken interface analysis. The three mechanisms are mixed metal formation, Ti oxidisation and diffusion between barrier metals and Al. Furthermore, TCT and PCT were carried out on these eutectic solder bumps to confirm the interconnection reliability. The TCT and PCT results prove that electrical connection is stable.

ジャーナルMicroelectronics International
出版ステータスPublished - 1997 9月

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 原子分子物理学および光学
  • 凝縮系物理学
  • 表面、皮膜および薄膜
  • 電子工学および電気工学


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