Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps,

S.Honma S.Honma; K.Tateyama K.Tateyama; H.Yamada H.Yamada; K.Doi K.Doi; N.Hirano N.Hirano; T.Okada T.Okada; C.Takubo C.Takubo; T.Sudo T.Sudo; Toshio Sudo

Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps,

S.Honma S.Honma, K.Tateyama K.Tateyama, H.Yamada H.Yamada, K.Doi K.Doi, N.Hirano N.Hirano, T.Okada T.Okada, C.Takubo C.Takubo, T.Sudo T.Sudo, Toshio Sudo

機能制御システム専攻

研究成果: Article › 査読

本文言語	English
ページ（範囲）	87-92
ジャーナル	ISHM ’96
出版ステータス	Published - 1996 10月 25

引用スタイル

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title = "Effectiveness of Thin Film Barrier Metals for Eutectic Solder Bumps,",

author = "S.Honma S.Honma and K.Tateyama K.Tateyama and H.Yamada H.Yamada and K.Doi K.Doi and N.Hirano N.Hirano and T.Okada T.Okada and C.Takubo C.Takubo and T.Sudo T.Sudo and Toshio Sudo",

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AU - S.Honma, S.Honma

AU - K.Tateyama, K.Tateyama

AU - H.Yamada, H.Yamada

AU - K.Doi, K.Doi

AU - N.Hirano, N.Hirano

AU - T.Okada, T.Okada

AU - C.Takubo, C.Takubo

AU - T.Sudo, T.Sudo

AU - Sudo, Toshio

PY - 1996/10/25

Y1 - 1996/10/25

M3 - Article

SP - 87

EP - 92

JO - ISHM ’96

JF - ISHM ’96

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