抄録
Radiating mechanism and reduction measures have been studied using test LSI and PCB. Among LSI operation modes, I/O buffer operation radiates the greatest amount of emission and shows that LSI mounting area behaves an opening from the electromagnetic viewpoint. The measure, decreasing extent of electromagnetic field at LSI mounting area, have been verified effective.
| 本文言語 | English |
|---|---|
| ページ | 25-28 |
| ページ数 | 4 |
| 出版ステータス | Published - 2001 12月 1 |
| イベント | IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - Cambridge, MA, United States 継続期間: 2001 10月 29 → 2001 10月 31 |
Conference
| Conference | IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging |
|---|---|
| 国/地域 | United States |
| City | Cambridge, MA |
| Period | 01/10/29 → 01/10/31 |
ASJC Scopus subject areas
- 工学（全般）