Electronic circuit formation on flexible polymer surface processed by 1 MV accelerated hydrogen molecular ions

Focused Hydrogen Molecular Beam (FHIB) is an extended technology to utilize accelerated proton to modify material that is Proton Beam Writer (PBW) Watt (1999) [1]. The unique characteristic of these technologies is their capability to modify engineering plastics such as polyester and polyimide of no photosensitivity. These engineering plastics are key materials to compose electronic circuits and devices. Therefore we have been researching to apply these technologies for making functional devices in various applications. FHIB especially H₃ ⁺ as the accelerating particle is proposed to improve productivity for industrial products Hayashi et al. (2017) [2]. In this report we show FHIB is properly applied to make distributed surface device of low profile that is useful to surface devices working at GHz to THz band applications. These bands are expected to provide the last communication carrier to fulfil the future wireless communication needs Oshima et al. (2017) [3]. We used 1MV accelerator to accelerate H₃ ⁺ and irradiated on the FPC surface before development process of 5% KOH to make engravings and nanometer sized silver oxide paste was used to fill.