TY - GEN
T1 - EMI reduction by chip-package-board co-design
AU - Kiyoshige, Sho
AU - Ichimura, Wataru
AU - Terasaki, Masahiro
AU - Kobayashi, Ryota
AU - Sudo, Toshio
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2014/10/20
Y1 - 2014/10/20
N2 - Electromagnetic radiation is always headachy issue in developing various electronic systems. Because electro-magnetic radiation and interference (EMI) is very sensitive to signal routing and physical layout of power distribution network (PDN) in package and board as well as chip design. Therefore, chip-package co-design is becoming important by taking into account the total PDN impedance seen from the chip. Especially, parallel resonance peaks in the PDN due to the chip-package interaction induces the unwanted power supply fluctuation, and results in serious EMI troubles. In this paper, three test chips were designed with different on-chip PDN properties. These three chips were intended to have typical characteristics; oscillatory region and damped condition. Then, the effects of the total PDN impedance on EMI have been studied. In particular, anti-resonance peak was properly suppressed by establishing critical damping condition in chip-package-board co-design. EMI has been proved to be dramatically reduced by proper combination of on-chip capacitance, on-chip resistance and package inductance.
AB - Electromagnetic radiation is always headachy issue in developing various electronic systems. Because electro-magnetic radiation and interference (EMI) is very sensitive to signal routing and physical layout of power distribution network (PDN) in package and board as well as chip design. Therefore, chip-package co-design is becoming important by taking into account the total PDN impedance seen from the chip. Especially, parallel resonance peaks in the PDN due to the chip-package interaction induces the unwanted power supply fluctuation, and results in serious EMI troubles. In this paper, three test chips were designed with different on-chip PDN properties. These three chips were intended to have typical characteristics; oscillatory region and damped condition. Then, the effects of the total PDN impedance on EMI have been studied. In particular, anti-resonance peak was properly suppressed by establishing critical damping condition in chip-package-board co-design. EMI has been proved to be dramatically reduced by proper combination of on-chip capacitance, on-chip resistance and package inductance.
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U2 - 10.1109/EMCEurope.2014.6931039
DO - 10.1109/EMCEurope.2014.6931039
M3 - Conference contribution
AN - SCOPUS:84908689041
T3 - IEEE International Symposium on Electromagnetic Compatibility
SP - 946
EP - 951
BT - IEEE International Symposium on Electromagnetic Compatibility
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2014 International Symposium on Electromagnetic Compatibility, EMC Europe 2014
Y2 - 1 September 2014 through 4 September 2014
ER -