TY - GEN
T1 - Evaluation of Adhesive Fracture Energy of Polyimide Interlayer Dielectric Film for Redistribution Layer of Semiconductor Package
AU - Ono, Kenta
AU - Kariya, Yoshiharu
PY - 2019/5
Y1 - 2019/5
N2 - The adhesive fracture energy \mathcal{G}-{c} of the polyimide film (PI) on the copper film was evaluated by the peel test. By obtaining \mathcal{G} in the actual redistribution layer structure by FEM analysis, the peel strength of PI on the copper circuit in the structure was evaluated by the master curve of \mathcal{G}-{c} established from the peel test result.
AB - The adhesive fracture energy \mathcal{G}-{c} of the polyimide film (PI) on the copper film was evaluated by the peel test. By obtaining \mathcal{G} in the actual redistribution layer structure by FEM analysis, the peel strength of PI on the copper circuit in the structure was evaluated by the master curve of \mathcal{G}-{c} established from the peel test result.
UR - http://www.scopus.com/inward/record.url?scp=85068374052&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85068374052&partnerID=8YFLogxK
U2 - 10.23919/LTB-3D.2019.8735249
DO - 10.23919/LTB-3D.2019.8735249
M3 - Conference contribution
AN - SCOPUS:85068374052
T3 - Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
BT - Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
Y2 - 21 May 2019 through 25 May 2019
ER -