Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test

Physics & Astronomy

• creep properties 100%
• solders 80%
• stress relaxation 78%
• evaluation 45%
• temperature 21%
• exponents 18%
• activation energy 17%
• microstructure 14%
• constitutive equations 12%
• balls 10%
• intermetallics 10%

Engineering & Materials Science

• Stress relaxation 86%
• Soldering alloys 70%
• Creep 62%
• Temperature 28%
• Activation energy 25%
• Microstructure 16%
• Constitutive equations 13%
• Intermetallics 12%

Chemical Compounds

• Stress Relaxation 96%
• Solder 89%
• Creep 88%
• Reaction Activation Energy 20%
• Microstructure 19%