Fatigue Crack Networks in the Die-Attach Joint of a Power Semiconductor Module During Power Cycling Testing and Effects of Test Parameters on the Joint Fatigue Life

Engineering & Materials Science

• Semiconductor materials 66%
• Fatigue of materials 51%
• Cracks 50%
• Testing 38%
• Temperature 29%
• Dynamic recrystallization 25%
• Strain energy 22%
• Creep 18%
• Lead-free solders 13%
• Thermal expansion 10%
• Grain boundaries 10%

Physics & Astronomy

• fatigue life 100%
• cracks 57%
• cycles 49%
• tensile creep 36%
• temperature 22%
• flux density 19%
• solders 13%
• thermal expansion 10%
• grain boundaries 9%
• energy 3%

Chemical Compounds

• Semiconductor 56%
• Strain Energy 47%
• Creep 45%
• Time 26%
• Thermal Expansion 19%
• Grain Boundary 19%