TY - GEN
T1 - Fatigue Life Prediction of BGA Solder Joint with Consideration of Microstructural Coarsening
AU - Moroka, Kouichi
AU - Kariya, Yoshiharu
PY - 2019/5
Y1 - 2019/5
N2 - The fatigue life of a joint in the semiconductor packagedecreases with an increase in creep deformation associated with microstructural changes occurred while in use. Particularly, the life difference in the field is remarkable. In life prediction, considering microstructural changes is absolutely necessary.
AB - The fatigue life of a joint in the semiconductor packagedecreases with an increase in creep deformation associated with microstructural changes occurred while in use. Particularly, the life difference in the field is remarkable. In life prediction, considering microstructural changes is absolutely necessary.
UR - http://www.scopus.com/inward/record.url?scp=85068359914&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85068359914&partnerID=8YFLogxK
U2 - 10.23919/LTB-3D.2019.8735151
DO - 10.23919/LTB-3D.2019.8735151
M3 - Conference contribution
AN - SCOPUS:85068359914
T3 - Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
BT - Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
Y2 - 21 May 2019 through 25 May 2019
ER -