Flexible Electrostatic Adhesive Device and its Performance Evaluations

Kotaro Takahashi; Tadahiro Hasegawa; Shinrichi Yuta

doi:10.1109/SII.2019.8700457

Flexible Electrostatic Adhesive Device and its Performance Evaluations

Kotaro Takahashi, Tadahiro Hasegawa, Shinrichi Yuta

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

A flexible electrostatic adhesive device was modified successfully to improve an aging characteristics. The experimental results using a previous electrostatic adhesive device has shown that, in concrete wall, the maximum adhesive force was 1kgf or more during applied voltage 10kV. However, problems that the adhesive force decreases depending on aging arose. To solve the problem, the design of the electrostatic device was modified. Thereby, the electrostatic adhesive device succeeded that an adhesive force was generated 1kgf or more during a month or more. The flexible electrostatic adhesive device is useful for a practical use to stick to an inspection apparatus on a concrete wall of a bridge or a tunnel.

本文言語	English
ホスト出版物のタイトル	Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019
出版社	Institute of Electrical and Electronics Engineers Inc.
ページ	679-682
ページ数	4
ISBN（電子版）	9781538636152
DOI	https://doi.org/10.1109/SII.2019.8700457
出版ステータス	Published - 2019 4月 25
イベント	2019 IEEE/SICE International Symposium on System Integration, SII 2019 - Paris, France 継続期間: 2019 1月 14 → 2019 1月 16

出版物シリーズ

名前	Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019

Conference

Conference	2019 IEEE/SICE International Symposium on System Integration, SII 2019
国/地域	France
City	Paris
Period	19/1/14 → 19/1/16

ASJC Scopus subject areas

原子分子物理学および光学
電子工学および電気工学

文献へのアクセス

10.1109/SII.2019.8700457

他のファイルとリンク

引用スタイル

Takahashi, K., Hasegawa, T., & Yuta, S. (2019). Flexible Electrostatic Adhesive Device and its Performance Evaluations. In Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019 (pp. 679-682). [8700457] (Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SII.2019.8700457

Flexible Electrostatic Adhesive Device and its Performance Evaluations. / Takahashi, Kotaro; Hasegawa, Tadahiro; Yuta, Shinrichi.

Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 679-682 8700457 (Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019).

研究成果: Conference contribution

Takahashi, K, Hasegawa, T & Yuta, S 2019, Flexible Electrostatic Adhesive Device and its Performance Evaluations. in Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019., 8700457, Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019, Institute of Electrical and Electronics Engineers Inc., pp. 679-682, 2019 IEEE/SICE International Symposium on System Integration, SII 2019, Paris, France, 19/1/14. https://doi.org/10.1109/SII.2019.8700457

Takahashi K, Hasegawa T, Yuta S. Flexible Electrostatic Adhesive Device and its Performance Evaluations. In Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 679-682. 8700457. (Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019). doi: 10.1109/SII.2019.8700457

Takahashi, Kotaro ; Hasegawa, Tadahiro ; Yuta, Shinrichi. / Flexible Electrostatic Adhesive Device and its Performance Evaluations. Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 679-682 (Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019).

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Flexible Electrostatic Adhesive Device and its Performance Evaluations

抄録

出版物シリーズ

Conference

ASJC Scopus subject areas

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