TY - JOUR
T1 - Folded U-shaped microwire technology for ultra-compact 3D MMICs
AU - Onodera, Kiyomitsu
AU - Hirano, Makoto
AU - Toyoda, Ichihiko
AU - Tokumitsu, Masami
AU - Tokumitsu, Tsuneo
PY - 1996/1/1
Y1 - 1996/1/1
N2 - A novel microwire technology has been developed to fabricate 3-dimensional structures for use in ultra-compact GaAs MMICs. By folding metal into a U-shaped wall and burying it in a relatively thick polyimide insulator, vertical microwires can be made with both greatly reduced process complexity and process compatibility with multi-level interconnects. The proposed microwires are suitable for miniature transmission lines, miniature inductors, shielding walls, and multi-function passive elements like baluns and couplers.
AB - A novel microwire technology has been developed to fabricate 3-dimensional structures for use in ultra-compact GaAs MMICs. By folding metal into a U-shaped wall and burying it in a relatively thick polyimide insulator, vertical microwires can be made with both greatly reduced process complexity and process compatibility with multi-level interconnects. The proposed microwires are suitable for miniature transmission lines, miniature inductors, shielding walls, and multi-function passive elements like baluns and couplers.
UR - http://www.scopus.com/inward/record.url?scp=0029697845&partnerID=8YFLogxK
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M3 - Conference article
AN - SCOPUS:0029697845
SN - 0149-645X
VL - 2
SP - 1153
EP - 1156
JO - IEEE MTT-S International Microwave Symposium Digest
JF - IEEE MTT-S International Microwave Symposium Digest
T2 - Proceedings of the 1996 IEEE MTT-S International Microwave Symposium Digest. Part 1 (of 3)
Y2 - 17 June 1996 through 21 June 1996
ER -