Folded U-shaped microwire technology for ultra-compact 3D MMICs

Kiyomitsu Onodera, Makoto Hirano, Ichihiko Toyoda, Masami Tokumitsu, Tsuneo Tokumitsu

    研究成果: Conference article査読

    4 被引用数 (Scopus)


    A novel microwire technology has been developed to fabricate 3-dimensional structures for use in ultra-compact GaAs MMICs. By folding metal into a U-shaped wall and burying it in a relatively thick polyimide insulator, vertical microwires can be made with both greatly reduced process complexity and process compatibility with multi-level interconnects. The proposed microwires are suitable for miniature transmission lines, miniature inductors, shielding walls, and multi-function passive elements like baluns and couplers.

    ジャーナルIEEE MTT-S International Microwave Symposium Digest
    出版ステータスPublished - 1996 1月 1
    イベントProceedings of the 1996 IEEE MTT-S International Microwave Symposium Digest. Part 1 (of 3) - San Franscisco, CA, USA
    継続期間: 1996 6月 171996 6月 21

    ASJC Scopus subject areas

    • 放射線
    • 凝縮系物理学
    • 電子工学および電気工学


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