Fundamental study on electrically-induced bubble catalytic plating technology

Yudai Fukuyama, Keita Ichikawa, Shingo Maeda, Yoko Yamanishi

研究成果: Conference contribution

抄録

We have succeeded in metallization by embedding metal on the flexible polymer substrate such as PDMS. Novel points of this technology are shown as follows. 1. It eliminates complicated pretreatment processes on the substrate surface before plating, so it is less expensive than electroless plating. 2. Plating resolution in micro-meter order can be achieved with low cost. 3. It is possible to perform local and precise metallization on a wide range of materials without using specialized techniques such as photolithography.

本文言語English
ホスト出版物のタイトルMHS 2017 - 28th 2017 International Symposium on Micro-NanoMechatronics and Human Science
出版社Institute of Electrical and Electronics Engineers Inc.
ページ1-3
ページ数3
ISBN(電子版)9781538633144
DOI
出版ステータスPublished - 2018 2月 28
外部発表はい
イベント28th International Symposium on Micro-NanoMechatronics and Human Science, MHS 2017 - Nagoya, Japan
継続期間: 2017 12月 32017 12月 6

出版物シリーズ

名前MHS 2017 - 28th 2017 International Symposium on Micro-NanoMechatronics and Human Science
2018-January

Other

Other28th International Symposium on Micro-NanoMechatronics and Human Science, MHS 2017
国/地域Japan
CityNagoya
Period17/12/317/12/6

ASJC Scopus subject areas

  • バイオテクノロジー
  • 生体医工学
  • 電子工学および電気工学
  • 機械工学

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