Future Trends for Interlayer Dielectric Films and Their Formation Technologies in VLSI Multilevel Interconnections

研究成果: Article › 査読

本文言語	English
ページ（範囲）	234-239
ジャーナル	Journal of Materials Chemistry and Physics
巻	41
出版ステータス	Published - 1995 4月 1

引用スタイル

@article{c0ae1afbe5c04262b648a3207f4f32bc,

title = "Future Trends for Interlayer Dielectric Films and Their Formation Technologies in VLSI Multilevel Interconnections",

author = "T. Homma",

year = "1995",

month = apr,

day = "1",

language = "English",

volume = "41",

pages = "234--239",

journal = "Journal of Materials Chemistry and Physics",

}