TY - GEN
T1 - Grain growth of electroplated copper film by alternative annealing methods
AU - Ueno, Kazuyoshi
AU - Shimotani, Kouichiro
AU - Shimada, Yuji
AU - Yomogida, Shigeru
AU - Takeshita, Takato
AU - Hashimoto, Akiko
AU - Yata, Takashi
PY - 2009/10/19
Y1 - 2009/10/19
N2 - Alternative annealing methods using current stress or supercritical fluid (SCF) are investigated for electroplated copper (Cu) films. The current stress method promotes grain growth at room temperature, mostly through the Joule heating effect. The grain size resulting from the SCF annealing method was more uniform; therefore, it is a potentially better method for improvement of the microstructure in electroplated Cu films.
AB - Alternative annealing methods using current stress or supercritical fluid (SCF) are investigated for electroplated copper (Cu) films. The current stress method promotes grain growth at room temperature, mostly through the Joule heating effect. The grain size resulting from the SCF annealing method was more uniform; therefore, it is a potentially better method for improvement of the microstructure in electroplated Cu films.
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M3 - Conference contribution
AN - SCOPUS:70349969400
SN - 9781605111254
T3 - Advanced Metallization Conference (AMC)
SP - 283
EP - 287
BT - Advanced Metallization Conference 2008, AMC 2008
T2 - Advanced Metallization Conference 2008, AMC 2008
Y2 - 23 September 2008 through 25 September 2008
ER -