HIGH SPEED AND RESOLUTION IMAGE SENSING HYBRID PACKAGE.

Toshio Sudo, Kohei Suzuki, Tamio Saito

研究成果: Conference article査読

2 被引用数 (Scopus)

抄録

A color image sensing hybrid module with high speed and high resolution has been developed. This module can be used for a facsimile set or an image processor or a copy apparatus as a read-out sensor. A multi-chip CCD image sensor is introduced. Eight on chip color filter CCD chips are staggered in two rows one after the other on a multilayer substrate. These chips are covered by a selectively transparent glass lid for shadowing unwanted areas. Consequently, the developed sensor can read an 8 1/2'' wide color manuscript with 12 dots/mm resolution and 2 msec/line reading speed.

本文言語English
ページ(範囲)547-550
ページ数4
ジャーナルInternational Journal of Microcircuits and Electronic Packaging
6
1
出版ステータスPublished - 1983
外部発表はい

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 安全性、リスク、信頼性、品質管理
  • 電子工学および電気工学

フィンガープリント

「HIGH SPEED AND RESOLUTION IMAGE SENSING HYBRID PACKAGE.」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル