TY - GEN
T1 - High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles
AU - Osaki, Koji
AU - Kariya, Yoshiharu
AU - Mizumura, Noritsuka
AU - Sasaki, Koji
PY - 2019/5
Y1 - 2019/5
N2 - The exponent of the fatigue crack propagation law of the sintered Ag was decreased with an increase in temperature. The decreasing the exponent was related to the viscous behavior of the grain boundaries. However, the exponent increased again at 473K that was associated by a decrease in CTOD due to progression of sintering.
AB - The exponent of the fatigue crack propagation law of the sintered Ag was decreased with an increase in temperature. The decreasing the exponent was related to the viscous behavior of the grain boundaries. However, the exponent increased again at 473K that was associated by a decrease in CTOD due to progression of sintering.
UR - http://www.scopus.com/inward/record.url?scp=85068367963&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85068367963&partnerID=8YFLogxK
U2 - 10.23919/LTB-3D.2019.8735315
DO - 10.23919/LTB-3D.2019.8735315
M3 - Conference contribution
AN - SCOPUS:85068367963
T3 - Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
BT - Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
Y2 - 21 May 2019 through 25 May 2019
ER -