Highly-integrated three-dimensional MMIC 20-GHz single chip receiver

Kenjiro Nishikawa, Kenji Kamogawa, Tsuneo Tokumitsu, Masayoshi Aikawa, Makoto Hirano, Suehiro Sugitani

研究成果: Paper査読

8 被引用数 (Scopus)

抄録

A highly-integrated, three-dimensional 20-GHz band single chip receiver employing four thin polyimide films on a GaAs wafer is presented. The fabricated receiver implements three RF variable-gain amplifiers, an image rejectlon mixer, two LO amplifiers, and a voltage controlled oscillatorin an areaof only 1.78 mm × 1.78 mm. The performances of the demonstrated receiver are a 17dB gain and an integration level about three times as high as those of conventional receiver MMICs. The design methodologies used to achieve compact RF circuits on a single chip are also described.

本文言語English
ページ199-203
ページ数5
DOI
出版ステータスPublished - 1996
外部発表はい
イベント1996 26th European Microwave Conference, EuMC 1996 - Prague, Czech Republic
継続期間: 1996 9月 61996 9月 13

Conference

Conference1996 26th European Microwave Conference, EuMC 1996
国/地域Czech Republic
CityPrague
Period96/9/696/9/13

ASJC Scopus subject areas

  • コンピュータ ネットワークおよび通信
  • ハードウェアとアーキテクチャ
  • 電子工学および電気工学

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