抄録
The author reports results of an investigation of the chip-to-chip signal propagation properties in a thin-film multichip module. The lossy transmission effects on the CMOS interface were analyzed by SPICE simulation and compared with an emitter-coupled logic interface. It is proved that CMOS-based multichip modules are less affected by the line resistance and have less power dissipation. An example of a CMOS-based multichip module using chip-on-wafer technology is introduced.
| 本文言語 | English |
|---|---|
| ページ（範囲） | 2304-2307 |
| ページ数 | 4 |
| ジャーナル | Proceedings - IEEE International Symposium on Circuits and Systems |
| 巻 | 4 |
| 出版ステータス | Published - 1991 12月 1 |
| イベント | 1991 IEEE International Symposium on Circuits and Systems Part 4 (of 5) - Singapore, Singapore 継続期間: 1991 6月 11 → 1991 6月 14 |
ASJC Scopus subject areas
- 電子工学および電気工学