TY - JOUR
T1 - Low-resistance metal contacts for nanocarbon/cobalt interconnects
AU - Ueno, Kazuyoshi
AU - Takagi, Masashi
AU - Yano, Hiroaki
AU - Wakui, Taichi
AU - Yamazaki, Yuichi
AU - Sakuma, Naoshi
AU - Kajita, Akihiro
AU - Sakai, Tadashi
PY - 2013/5
Y1 - 2013/5
N2 - Low-resistance metal contacts for CVD-nanocarbon (NC)/cobalt (Co) interconnects have been investigated among contact metals such as Ni, Ti, Au, and Cu. Contact resistivity was independent of contact area owing to low-resistance NC/Co interconnect structure. The lowest contact resistivity and superior adhesion were obtained from Ni. Although the factors for the low contact resistivity were not clear enough from the comparison of work-function difference and adhesion strength for the contact metals, Ni is a promising low-resistivity contact metal for CVD-NC interconnects in the future.
AB - Low-resistance metal contacts for CVD-nanocarbon (NC)/cobalt (Co) interconnects have been investigated among contact metals such as Ni, Ti, Au, and Cu. Contact resistivity was independent of contact area owing to low-resistance NC/Co interconnect structure. The lowest contact resistivity and superior adhesion were obtained from Ni. Although the factors for the low contact resistivity were not clear enough from the comparison of work-function difference and adhesion strength for the contact metals, Ni is a promising low-resistivity contact metal for CVD-NC interconnects in the future.
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U2 - 10.7567/JJAP.52.05FD01
DO - 10.7567/JJAP.52.05FD01
M3 - Article
AN - SCOPUS:84880859552
SN - 0021-4922
VL - 52
JO - Japanese Journal of Applied Physics
JF - Japanese Journal of Applied Physics
IS - 5 PART 4
M1 - 05FD01
ER -