Microstructure of electroplated copper in damascene structures: effects of barrier layers and geometry

M.E.Gross M.E.Gross, E.Coleman E.Coleman, W.Lai W.Lai, J.Miner J.Miner, T.Ritzdorf T.Ritzdorf, J.Turner J.Turner, K.Gibbons K.Gibbons, E.klawuhn E.klawuhn, M.Biberger M.Biberger, K.Ueno K.Ueno, Y.Tsuchiya Y.Tsuchiya, N.Ito N.Ito, Kazuyoshi Ueno

研究成果: Article査読

ジャーナルAdvanced Interconnects and Contact Materials and Processes for Future ICs
出版ステータスPublished - 1997 10月 1