Microstructure of electroplated copper in damascene structures: effects of barrier layers and geometry

M.E.Gross M.E.Gross; E.Coleman E.Coleman; W.Lai W.Lai; J.Miner J.Miner; T.Ritzdorf T.Ritzdorf; J.Turner J.Turner; K.Gibbons K.Gibbons; E.klawuhn E.klawuhn; M.Biberger M.Biberger; K.Ueno K.Ueno; Y.Tsuchiya Y.Tsuchiya; N.Ito N.Ito; Kazuyoshi Ueno

Microstructure of electroplated copper in damascene structures: effects of barrier layers and geometry

M.E.Gross M.E.Gross, E.Coleman E.Coleman, W.Lai W.Lai, J.Miner J.Miner, T.Ritzdorf T.Ritzdorf, J.Turner J.Turner, K.Gibbons K.Gibbons, E.klawuhn E.klawuhn, M.Biberger M.Biberger, K.Ueno K.Ueno, Y.Tsuchiya Y.Tsuchiya, N.Ito N.Ito, Kazuyoshi Ueno

機能制御システム専攻

研究成果: Article › 査読

本文言語	English
ジャーナル	Advanced Interconnects and Contact Materials and Processes for Future ICs
出版ステータス	Published - 1997 10月 1

引用スタイル

M.E.Gross, M. E. G., E.Coleman, E. C., W.Lai, W. L., J.Miner, J. M., T.Ritzdorf, T. R., J.Turner, J. T., K.Gibbons, K. G., E.klawuhn, E. K., M.Biberger, M. B., K.Ueno, K. U., Y.Tsuchiya, Y. T., N.Ito, N. I., & Ueno, K. (1997). Microstructure of electroplated copper in damascene structures: effects of barrier layers and geometry. Advanced Interconnects and Contact Materials and Processes for Future ICs.

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AU - E.Coleman, E.Coleman

AU - W.Lai, W.Lai

AU - J.Miner, J.Miner

AU - T.Ritzdorf, T.Ritzdorf

AU - J.Turner, J.Turner

AU - K.Gibbons, K.Gibbons

AU - E.klawuhn, E.klawuhn

AU - M.Biberger, M.Biberger

AU - K.Ueno, K.Ueno

AU - Y.Tsuchiya, Y.Tsuchiya

AU - N.Ito, N.Ito

AU - Ueno, Kazuyoshi

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JO - Advanced Interconnects and Contact Materials and Processes for Future ICs

JF - Advanced Interconnects and Contact Materials and Processes for Future ICs

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