TY - JOUR
T1 - Millimeter-wave three-dimensional masterslice MMICs
AU - Nishikawa, Kenjiro
AU - Kamogawa, Kenji
AU - Inoue, Koh
AU - Onodera, Kiyomitsu
AU - Hirano, Makoto
AU - Tokumitsu, Tsuneo
AU - Toyoda, Ichihiko
PY - 1998/1/1
Y1 - 1998/1/1
N2 - The three-dimensional (3D) masterslice MMIC technology has, even in the millimeter-wave region, the advantages of high integration levels, simple design procedures, short turn-around-time, and low fabrication cost. Fabricated V-band amplifiers achieve an 8-db gain and a 5.3 dB noise figure in an area of 0.27 mm2. A U-band single-chip downconverter is also demonstrated.
AB - The three-dimensional (3D) masterslice MMIC technology has, even in the millimeter-wave region, the advantages of high integration levels, simple design procedures, short turn-around-time, and low fabrication cost. Fabricated V-band amplifiers achieve an 8-db gain and a 5.3 dB noise figure in an area of 0.27 mm2. A U-band single-chip downconverter is also demonstrated.
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M3 - Conference article
AN - SCOPUS:0031645239
SN - 0149-645X
VL - 1
SP - 313
EP - 316
JO - IEEE MTT-S International Microwave Symposium Digest
JF - IEEE MTT-S International Microwave Symposium Digest
T2 - Proceedings of the 1998 IEEE MTT-S International Microwave Symposium. Part 1 (of 3)
Y2 - 7 June 1998 through 12 June 1998
ER -