抄録
The three-dimensional (3D) masterslice MMIC technology has, even in the millimeter-wave region, the advantages of high integration levels, simple design procedures, short turn-around-time, and low fabrication cost. Fabricated V-band amplifiers achieve an 8-dB gain and a 5.3 dB noise figure in an area of 0.27 mm2. A U-band single-chip downconverter is also demonstrated.
| 本文言語 | English |
|---|---|
| ホスト出版物のタイトル | IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers |
| Place of Publication | Piscataway, NJ, United States |
| 出版社 | IEEE |
| ページ | 239-242 |
| ページ数 | 4 |
| 出版ステータス | Published - 1998 |
| 外部発表 | はい |
| イベント | Proceedings of the 1998 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium - Baltimore, MD, USA 継続期間: 1998 6月 7 → 1998 6月 11 |
Other
| Other | Proceedings of the 1998 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium |
|---|---|
| City | Baltimore, MD, USA |
| Period | 98/6/7 → 98/6/11 |
ASJC Scopus subject areas
- 電子工学および電気工学
- メディア記述