本文言語 | English |
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ジャーナル | VLSI Packaging Workshop Japan |
出版ステータス | Published - 1992 12月 1 |
Minimization of Effective Inductance of Ground Plane and Experimental Simultaneous Switching Noise in a Multilayer VLSI Package,
Y.Hiruta Y.Hiruta, N.Hirano N.Hirano, T.Sudo T.Sudo, Toshio Sudo
研究成果: Article › 査読