Minimization of Effective Inductance of Ground Plane and Experimental Simultaneous Switching Noise in a Multilayer VLSI Package,

Y.Hiruta Y.Hiruta, N.Hirano N.Hirano, T.Sudo T.Sudo, Toshio Sudo

研究成果: Article査読

本文言語English
ジャーナルVLSI Packaging Workshop Japan
出版ステータスPublished - 1992 12月 1

引用スタイル