Multichip Module Technology using AIN Substrate for 2-Gbit/s High-Speed Switching Module

Y. Iseki, F. Shimizu, T. Sudo

研究成果: Article › 査読

本文言語	English
ページ（範囲）	973-978
ジャーナル	ECTC(Electronic Components and Technology Conference) '92
出版ステータス	Published - 1992 5月 1

引用スタイル

@article{2ad99a10b50b4caeb79329dfcb5b44b9,

title = "Multichip Module Technology using AIN Substrate for 2-Gbit/s High-Speed Switching Module",

author = "Y. Iseki and F. Shimizu and T. Sudo",

year = "1992",

month = may,

day = "1",

language = "English",

pages = "973--978",

journal = "ECTC(Electronic Components and Technology Conference) '92",

}