抄録
Multilevel interconnection technology has become essential for the development of high density and high integration of LSIs in recent years. Planarization of interlayer dielectrics is very important for highly reliable, fine multilevel interconnections. In this article, we will discuss the development process and the features of a new polyimide siloxane film in contrast with problems of conventional polyimide film, and will outline the practical application.
| 本文言語 | English |
|---|---|
| ページ（範囲） | 74-79 |
| ページ数 | 6 |
| ジャーナル | JEE. Journal of electronic engineering |
| 巻 | 25 |
| 号 | 263 |
| 出版ステータス | Published - 1988 11月 1 |
| 外部発表 | はい |
ASJC Scopus subject areas
- 工学（全般）