@inproceedings{cdce1742c0724283a77729e103937897,
title = "Novel fabrication technology for ultra-compact three-dimensional MMICs",
abstract = "A novel interconnection technology has been developed for ultra-compact three-dimensional (3D) MMICs. A sophisticated 3D interconnection structure has been successfully fabricated using inductively-coupled-plasma etching with a doublelayer mask. This technology enables us to realize an ultra-compact MMICs.",
author = "Suehiro Sugitani and Kiyomitsu Onodera and Shinji Aoyama and Makoto Hirano and Kimiyoshi Yamasaki",
year = "1997",
month = jan,
day = "1",
doi = "10.1109/ESSDERC.1997.194420",
language = "English",
series = "European Solid-State Device Research Conference",
publisher = "IEEE Computer Society",
pages = "280--283",
editor = "H. Grunbacher",
booktitle = "European Solid-State Device Research Conference",
note = "27th European Solid-State Device Research Conference, ESSDERC 1997 ; Conference date: 22-09-1997 Through 24-09-1997",
}