Novel structure to realize crack-free plastic package during reflow soldering process - development of chip side-support (CSS) package

Tsutomu Nakazawa; Yumi Inoue; Kanako Sawada; Toshio Sudo

doi:10.1109/3476.484206

Novel structure to realize crack-free plastic package during reflow soldering process - development of chip side-support (CSS) package

Tsutomu Nakazawa, Yumi Inoue, Kanako Sawada, Toshio Sudo

研究成果: Article › 査読

3 被引用数 (Scopus)

抄録

A crack-free package that does not require moisture-proof packing can be realized by eliminating a die-pad and using the chip side support (CSS) method. The CSS packages of .45-mm thickness did not show any cracks at the reflow temperature of 240°C for saturated moisture of 85% relative humidity. The design criteria of crack-free package was established by calculating the shear stress and comparing it to the shear strength at the interface between the chip and the mold resin.

本文言語	English
ページ（範囲）	61-69
ページ数	9
ジャーナル	IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing
巻	19
号	1
DOI	https://doi.org/10.1109/3476.484206
出版ステータス	Published - 1996
外部発表	はい

ASJC Scopus subject areas

工学（全般）

文献へのアクセス

10.1109/3476.484206

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引用スタイル

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