A crack-free package that does not require moisture-proof packing can be realized by eliminating a die-pad and using the chip side support (CSS) method. The CSS packages of .45-mm thickness did not show any cracks at the reflow temperature of 240°C for saturated moisture of 85% relative humidity. The design criteria of crack-free package was established by calculating the shear stress and comparing it to the shear strength at the interface between the chip and the mold resin.
|ジャーナル||IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing|
|出版ステータス||Published - 1996|
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