Novel structure to realize crack-free plastic package during reflow soldering process - development of CSS (chip side support) package -

Tsutomu Nakazawa; Yumi Inoue; Kanako Sawada; Toshio Sudo

Novel structure to realize crack-free plastic package during reflow soldering process - development of CSS (chip side support) package -

Tsutomu Nakazawa, Yumi Inoue, Kanako Sawada, Toshio Sudo

電気電子情報工学専攻

研究成果: Paper › 査読

抄録

This paper reports a novel structure of a plastic package without a die-pad, whereby adhesion strength is improved and thermal stress reduced. The non-die-pad structure has been realized by the chip side support method. Further, the derivation of an equation that can be used as a criterion for judging package cracking or delamination is described by comparing the shear strength with the shear stress. The equation for shear stress can be estimated by the finite element method.

本文言語	English
ページ	310-317
ページ数	8
出版ステータス	Published - 1995 12月 1
イベント	Proceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium - Austin, TX, USA 継続期間: 1995 10月 2 → 1995 10月 4

Other

Other	Proceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium
City	Austin, TX, USA
Period	95/10/2 → 95/10/4

ASJC Scopus subject areas

産業および生産工学
電子工学および電気工学

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フィンガープリント

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引用スタイル

Novel structure to realize crack-free plastic package during reflow soldering process - development of CSS (chip side support) package -. / Nakazawa, Tsutomu; Inoue, Yumi; Sawada, Kanako その他.

1995. 310-317 Paper presented at Proceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, USA.

研究成果: Paper › 査読

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abstract = "This paper reports a novel structure of a plastic package without a die-pad, whereby adhesion strength is improved and thermal stress reduced. The non-die-pad structure has been realized by the chip side support method. Further, the derivation of an equation that can be used as a criterion for judging package cracking or delamination is described by comparing the shear strength with the shear stress. The equation for shear stress can be estimated by the finite element method.",

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N2 - This paper reports a novel structure of a plastic package without a die-pad, whereby adhesion strength is improved and thermal stress reduced. The non-die-pad structure has been realized by the chip side support method. Further, the derivation of an equation that can be used as a criterion for judging package cracking or delamination is described by comparing the shear strength with the shear stress. The equation for shear stress can be estimated by the finite element method.

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