TY - GEN
T1 - PDN characteristics of 3D-SiP with a wide-bus structure under 4k-IO operations
AU - Sakai, Atsushi
AU - Yamada, Shigeru
AU - Kariya, Takashi
AU - Uchiyama, Shiro
AU - Ikeda, Hiroaki
AU - Fujita, Haruya
AU - Takatani, Hiroki
AU - Tanaka, Yosuke
AU - Oizono, Yoshiaki
AU - Nabeshima, Yoshitaka
AU - Sudo, Toshio
PY - 2012/12/1
Y1 - 2012/12/1
N2 - The 4096 bits wide-bus three-dimensional integration device using through-silicon-vias (TSVs) has been designed and fabricated as a demonstrator for power integrity such as power distribution network (PDN) impedance and simultaneous switching output (SSO) noise characteristics. Anti-resonance peak of total PDN impedance was extracted at around 80 MHz. This result was well coincident with maximum SSO noise frequency at around 75 MHz. Further, SSO noise reduction clocking named phase-shift clock has also been implemented to demonstrate the effectiveness as measurement basis.
AB - The 4096 bits wide-bus three-dimensional integration device using through-silicon-vias (TSVs) has been designed and fabricated as a demonstrator for power integrity such as power distribution network (PDN) impedance and simultaneous switching output (SSO) noise characteristics. Anti-resonance peak of total PDN impedance was extracted at around 80 MHz. This result was well coincident with maximum SSO noise frequency at around 75 MHz. Further, SSO noise reduction clocking named phase-shift clock has also been implemented to demonstrate the effectiveness as measurement basis.
UR - http://www.scopus.com/inward/record.url?scp=84879767689&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84879767689&partnerID=8YFLogxK
U2 - 10.1109/ICSJ.2012.6523460
DO - 10.1109/ICSJ.2012.6523460
M3 - Conference contribution
AN - SCOPUS:84879767689
SN - 9781467326551
T3 - 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
BT - 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
T2 - 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
Y2 - 10 December 2012 through 12 December 2012
ER -