PDN Impedance and Noise Modeling of 3D System-in-Package with a Widebus Structure

T.Sudo T.Sudo; Y.Oizono Y.Oizono; Y.Nabeshima Y.Nabeshima; T.Okumura T.Okumura; A.Sakai A.Sakai; S.Uchiyam S.Uchiyam; H.Ikeda H.Ikeda; Toshio Sudo

PDN Impedance and Noise Modeling of 3D System-in-Package with a Widebus Structure

T.Sudo T.Sudo, Y.Oizono Y.Oizono, Y.Nabeshima Y.Nabeshima, T.Okumura T.Okumura, A.Sakai A.Sakai, S.Uchiyam S.Uchiyam, H.Ikeda H.Ikeda, Toshio Sudo

機能制御システム専攻

研究成果: Article › 査読

本文言語	English
ジャーナル	Proceedings of IEEE 3DIC 2011
出版ステータス	Published - 2012 2月 2

引用スタイル

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title = "PDN Impedance and Noise Modeling of 3D System-in-Package with a Widebus Structure",

author = "T.Sudo T.Sudo and Y.Oizono Y.Oizono and Y.Nabeshima Y.Nabeshima and T.Okumura T.Okumura and A.Sakai A.Sakai and S.Uchiyam S.Uchiyam and H.Ikeda H.Ikeda and Toshio Sudo",

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AU - T.Sudo, T.Sudo

AU - Y.Oizono, Y.Oizono

AU - Y.Nabeshima, Y.Nabeshima

AU - T.Okumura, T.Okumura

AU - A.Sakai, A.Sakai

AU - S.Uchiyam, S.Uchiyam

AU - H.Ikeda, H.Ikeda

AU - Sudo, Toshio

PY - 2012/2/2

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M3 - Article

JO - Proceedings of IEEE 3DIC 2011

JF - Proceedings of IEEE 3DIC 2011

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