TY - JOUR
T1 - Preparation and characterization of highly c-axis-oriented Bi4Ti3O12 thin films
AU - Yamaguchi, Masaki
AU - Kawanabe, Kensuke
AU - Nagatomo, Takao
AU - Omoto, Osamu
PY - 1996/10/1
Y1 - 1996/10/1
N2 - Highly c-axis-oriented bismuth titanate (Bi4Ti3O12) thin films were prepared on (100)-oriented silicon wafers by rf planar magnetron sputtering using a target of Bi2TiO5 ceramic at a low substrate temperature of 600°C. The films with a c-axis orientation up to 99% were obtained under high deposition rate approximately 1.1 μm h 1. Dielectric constant of these films were dependence of film thickness. This behavior was explained assuming a low-dielectric-constant interface layer. Using this assumption, the dielectric constant of Bi4Ti3O12 film was estimated to be approximately 140. This value is similar to that along the c-axis in a bulk form. A D E hysteresis characteristic has been observed at room temperature. The remanent polarization and the coercive field are 0.8 μC cm 2 and 20 k V cm 1, respectively. From analysis of refractive index, interface layer was confirmed an oxidized silicon, which was formed before and/or during film deposition.
AB - Highly c-axis-oriented bismuth titanate (Bi4Ti3O12) thin films were prepared on (100)-oriented silicon wafers by rf planar magnetron sputtering using a target of Bi2TiO5 ceramic at a low substrate temperature of 600°C. The films with a c-axis orientation up to 99% were obtained under high deposition rate approximately 1.1 μm h 1. Dielectric constant of these films were dependence of film thickness. This behavior was explained assuming a low-dielectric-constant interface layer. Using this assumption, the dielectric constant of Bi4Ti3O12 film was estimated to be approximately 140. This value is similar to that along the c-axis in a bulk form. A D E hysteresis characteristic has been observed at room temperature. The remanent polarization and the coercive field are 0.8 μC cm 2 and 20 k V cm 1, respectively. From analysis of refractive index, interface layer was confirmed an oxidized silicon, which was formed before and/or during film deposition.
KW - Crystalline structure
KW - Dielectric properties
KW - Refractive index
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U2 - 10.1016/S0921-5107(96)01640-6
DO - 10.1016/S0921-5107(96)01640-6
M3 - Article
AN - SCOPUS:0030260564
SN - 0921-5107
VL - 41
SP - 138
EP - 142
JO - Materials Science and Engineering B: Solid-State Materials for Advanced Technology
JF - Materials Science and Engineering B: Solid-State Materials for Advanced Technology
IS - 1
ER -