Recycling SiC Focus Rings for Reactive Ion Etching Equipment by Insertless Diffusion Bonding using Hot Isostatic Pressing

Engineering & Materials Science

• Diffusion bonding 100%
• Reactive ion etching 99%
• Hot isostatic pressing 93%
• Recycling 72%
• Cleaning 45%
• Dry cleaning 41%
• Chemical vapor deposition 28%
• Etching 26%
• Plasmas 22%
• Oxides 21%
• Surface roughness 20%
• Tensile strength 19%
• Air 13%
• Costs 9%

Chemical Compounds

• Recycling 66%
• Etching 66%
• Diffusion 45%
• Dry Cleaning 39%
• Ion 29%
• Aqueous Solution 25%
• Surface Roughness 24%
• Surface 23%
• Chemical Vapour Deposition 22%
• Tensile Strength 20%
• Resistance 15%
• Plasma 15%
• Oxide 13%