TY - JOUR
T1 - Reinforcement of power factor in N-type multiphase thin film of Si1−x−yGexSny by mitigating the opposing behavior of Seebeck coefficient and electrical conductivity
AU - Lai, Huajun
AU - Peng, Ying
AU - Gao, Jie
AU - Song, Haili
AU - Kurosawa, Masashi
AU - Nakatsuka, Osamu
AU - Takeuchi, Tsunehiro
AU - Miao, Lei
N1 - Funding Information:
This work was partly supported by the National Natural Science Foundation of China (Grant Nos. 51772056 and 52061009), the study abroad program for graduate student of Guilin University of Electronic Technology (Grant No. GDYX2019002), JSPS KAKENHI (Nos. 20H05188, 21H01366, and 20K22486) in Japan, and CREST (Grant No. JPMJCR19Q5) from the JST in Japan.
Publisher Copyright:
© 2021 Author(s).
PY - 2021/9/13
Y1 - 2021/9/13
N2 - As the first-generation semiconductor, silicon (Si) exhibits promising prospects in thermoelectric (TE) convention application with the advantages of un-toxic, abundant, robust, and compliant to the integrated circuit. However, Si-based TE materials are always implemented for high-temperature application and deficient at room temperature (RT) ambience. This study displays an N-type Si1−x−yGexSny thin film by carrying out the strategy of metallic modulation doping for enhancing its power factor (PF). It was distinct to observe the extra carriers poured from the precipitated Sn particles without prominent degradation of mobility while sustaining appreciable thermal conductivity. The PF of 12.212and zT of 0.27 were achieved at 125 °C, which illustrated the significant potential for implementation at near RT ambiance.
AB - As the first-generation semiconductor, silicon (Si) exhibits promising prospects in thermoelectric (TE) convention application with the advantages of un-toxic, abundant, robust, and compliant to the integrated circuit. However, Si-based TE materials are always implemented for high-temperature application and deficient at room temperature (RT) ambience. This study displays an N-type Si1−x−yGexSny thin film by carrying out the strategy of metallic modulation doping for enhancing its power factor (PF). It was distinct to observe the extra carriers poured from the precipitated Sn particles without prominent degradation of mobility while sustaining appreciable thermal conductivity. The PF of 12.212and zT of 0.27 were achieved at 125 °C, which illustrated the significant potential for implementation at near RT ambiance.
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U2 - 10.1063/5.0062339
DO - 10.1063/5.0062339
M3 - Article
AN - SCOPUS:85115335940
SN - 0003-6951
VL - 119
JO - Applied Physics Letters
JF - Applied Physics Letters
IS - 11
M1 - 113903
ER -