TY - GEN
T1 - Reproduction analysis of fatigue crack networks in Sn-Ag-Cu die attach joint by FEA
AU - Kanai, Hiroki
AU - Kariya, Yoshiharu
AU - Abe, Yoshiki
AU - Yokoyama, Yoshinori
AU - Ochi, Koki
AU - Hanada, Ryuichiro
AU - Izuo, Shinichi
N1 - Publisher Copyright:
© 2021 IEEE
PY - 2021/10/5
Y1 - 2021/10/5
N2 - The formation process of fatigue crack networks in SnAg-Cu die attach joint was experimentally observed, and reproduced by the Finite Element method Analysis (FEA) based on a crack initiation rule described by the logistic function and Paris type fatigue crack propagation law.
AB - The formation process of fatigue crack networks in SnAg-Cu die attach joint was experimentally observed, and reproduced by the Finite Element method Analysis (FEA) based on a crack initiation rule described by the logistic function and Paris type fatigue crack propagation law.
UR - http://www.scopus.com/inward/record.url?scp=85120423218&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85120423218&partnerID=8YFLogxK
U2 - 10.1109/LTB-3D53950.2021.9598392
DO - 10.1109/LTB-3D53950.2021.9598392
M3 - Conference contribution
AN - SCOPUS:85120423218
T3 - 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
SP - 43
BT - 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
Y2 - 5 October 2021 through 11 October 2021
ER -