TY - GEN
T1 - RISC-based multichip modules for workstation performance comparison among types of MCMs
AU - Okada, T.
AU - Hayashida, H.
AU - Yamaji, J.
AU - Watanabe, S.
AU - Sudo, T.
AU - Hitosugi, M.
PY - 1993/12/1
Y1 - 1993/12/1
N2 - Multichip module (MCM) technology is becoming important for high performance workstations and personal computers. With the increasing clock frequency of RISC processors, the electrical design of the board has become difficult due to interconnect delay and reflection and switching noise. This paper describes two types of MCMs, each of which consists of an R4000 chip and eleven iM bit static RAM chips. One is MCM-Si type, which consists of bare chips on a silicon wafer substrate. The other is MCM-C type, which is made of cofired multilayer ceramics with packaged devices on the back side of the package.
AB - Multichip module (MCM) technology is becoming important for high performance workstations and personal computers. With the increasing clock frequency of RISC processors, the electrical design of the board has become difficult due to interconnect delay and reflection and switching noise. This paper describes two types of MCMs, each of which consists of an R4000 chip and eleven iM bit static RAM chips. One is MCM-Si type, which consists of bare chips on a silicon wafer substrate. The other is MCM-C type, which is made of cofired multilayer ceramics with packaged devices on the back side of the package.
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M3 - Conference contribution
AN - SCOPUS:0027809295
SN - 0930815378
T3 - Proceedings of SPIE - The International Society for Optical Engineering
SP - 230
EP - 237
BT - Proceedings of SPIE - The International Society for Optical Engineering
A2 - Anon, null
PB - Publ by Society of Photo-Optical Instrumentation Engineers
T2 - Proceedings of the International Conference and Exhibition on Multichip Modules
Y2 - 14 April 1993 through 16 April 1993
ER -