Silicon surface processing techniques for micro-systems fabrication

Vygantas Mizeikis, Saulius Juodkazis, Jia Yu Ye, Andrei Rode, Shigeki Matsuo, Hiroaki Misawa

研究成果: Conference article査読

18 被引用数 (Scopus)


Micromachining of silicon surface and near-surface regions by electron-beam lithography (EBL) and reactive ion dry-etching (RIE), as well as by laser microfabrication techniques is described. Combination of EBL and RIE techniques is used to fabricate quasi two-dimensional (2D) photonic crystal (PhC) structures with aspect ratios at approximately 15. Structural and optical properties of PhC samples with 2D honeycomb lattice are reported, and a complete photonic band gap at wavelengths approximately 2.16 μm is identified from the optical transmission data. Next, laser microfabrication of silicon by femtosecond laser pulses is reported. Processing of silicon under low air pressure conditions (≃5 Torr) is demonstrated to be essentially debris-free process, highly suitable for cutting and scribing of wafers as well for hole drilling. Removal of thin films from the silicon surface by a single-shot laser ablation using mask projection is also demonstrated.

ジャーナルThin Solid Films
出版ステータスPublished - 2003 8月 22
イベントThe 5th International Conference on Nano-Molecular Electronics - Kobe, Japan
継続期間: 2002 12月 102002 12月 12

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 表面および界面
  • 表面、皮膜および薄膜
  • 金属および合金
  • 材料化学


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