TY - GEN
T1 - Simplified and practical estimation of package cracking during reflow soldering process
AU - Sawada, K.
AU - Nakazawa, T.
AU - Kawamura, N.
AU - Matsumoto, K.
AU - Hiruta, Y.
AU - Sudo, T.
PY - 1994
Y1 - 1994
N2 - A simple method has been developed to estimate cracking of plastic packages during reflow soldering process. A criterion for estimating package cracking has been introduced by comparing the mold resin fracture toughness and the maximum value of the stress intensity factor in the package. The criterion equation for package cracking was made to an empirical form. The real-time measurement of package deformation is effective for providing information on the difference of the fracture mode. The difference of the delamination in the package causes the different shape of the deformation curve. The absorption characteristic of the package obeys Fick's law even for thinner packages.
AB - A simple method has been developed to estimate cracking of plastic packages during reflow soldering process. A criterion for estimating package cracking has been introduced by comparing the mold resin fracture toughness and the maximum value of the stress intensity factor in the package. The criterion equation for package cracking was made to an empirical form. The real-time measurement of package deformation is effective for providing information on the difference of the fracture mode. The difference of the delamination in the package causes the different shape of the deformation curve. The absorption characteristic of the package obeys Fick's law even for thinner packages.
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U2 - 10.1109/relphy.1994.307848
DO - 10.1109/relphy.1994.307848
M3 - Conference contribution
AN - SCOPUS:0028194812
SN - 0780313577
SN - 9780780313576
T3 - Annual Proceedings - Reliability Physics (Symposium)
SP - 114
EP - 119
BT - Annual Proceedings - Reliability Physics (Symposium)
PB - Publ by IEEE
T2 - Proceedings of the 32nd Annual International Reliability Physics Proceedings
Y2 - 12 April 1994 through 14 April 1994
ER -