Simulation of a Cutting Flow Mode of MR Fluid Based on DEM

Dan Kawai, Satoko Abiko, Teppei Tsujita

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

This paper describes a simulation of a cutting flow mode of MR (Magneto-Rheological) fluid using DEM (Discrete Element Method). The authors have studied an encountered-type haptic interface using MR fluid for the application of a surgical simulator, which can allow an operator to sense cutting force by directly cutting the MR fluid with a surgical knife. To develop an advanced haptic interface with the MR fluid, a prediction of the behavior of ferromagnetic particles in the fluid and the forces applied to the knife in advance are required. Therefore, this paper realizes flow visualization of the MR fluid and develops a DEM simulator. The flow visualiation revealed that entire chain clusters of the particles draged into the direction of the knife movement while the part of the clusters were cut by the cutting edge of the knife in the knife insertion. When the knife was pulled out, the cut clusters remained their shapes and the particles did not remake the chain clusters around those areas even under the condition of the magnetic field. Besides, it was observed that the particles contacted with the side surfaces of the knife or the boundary walls sliped on the surfaces. The DEM simulation in this study introduces the effect of the knife movement in the fluid and the friction effect on the surfaces in addition to the conventional MR fluid model. The simulation results show that overall behaviour of the MR fluid can be reproduced.

本文言語English
ホスト出版物のタイトルProceedings of the 2020 IEEE/SICE International Symposium on System Integration, SII 2020
出版社Institute of Electrical and Electronics Engineers Inc.
ページ45-51
ページ数7
ISBN(電子版)9781728166674
DOI
出版ステータスPublished - 2020 1月
イベント2020 IEEE/SICE International Symposium on System Integration, SII 2020 - Honolulu, United States
継続期間: 2020 1月 122020 1月 15

出版物シリーズ

名前Proceedings of the 2020 IEEE/SICE International Symposium on System Integration, SII 2020

Conference

Conference2020 IEEE/SICE International Symposium on System Integration, SII 2020
国/地域United States
CityHonolulu
Period20/1/1220/1/15

ASJC Scopus subject areas

  • 人工知能
  • コンピュータ サイエンスの応用
  • 生体医工学
  • 制御およびシステム工学
  • 安全性、リスク、信頼性、品質管理
  • 制御と最適化
  • 器械工学

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