TY - GEN
T1 - Simulation of lag and current slump in AlGaN/GaN HEMTs as affected by buffer trapping
AU - Nakajima, A.
AU - Itagaki, K.
AU - Horio, K.
PY - 2007
Y1 - 2007
N2 - Two-dimensional transient simulations of AlGaN/GaN HEMTs are performed in which a deep donor and a deep acceptor are considered in a semi-insulating buffer layer. It is shown that lag phenomena and current slump could be reproduced. Particularly, it is shown that gate lag is correlated with relatively high source access resistance of AlGaN/GaN HEMTs, and that drain lag could be a major cause of current slump. The current slump is more pronounced when the deep-acceptor density in the buffer layer is higher and when an off-state drain voltage is higher, because trapping effects become more significant. It is concluded that an acceptor density in the buffer layer should be made low to minimize current slump, although current cutoff behavior may be degraded when the gate length is short.
AB - Two-dimensional transient simulations of AlGaN/GaN HEMTs are performed in which a deep donor and a deep acceptor are considered in a semi-insulating buffer layer. It is shown that lag phenomena and current slump could be reproduced. Particularly, it is shown that gate lag is correlated with relatively high source access resistance of AlGaN/GaN HEMTs, and that drain lag could be a major cause of current slump. The current slump is more pronounced when the deep-acceptor density in the buffer layer is higher and when an off-state drain voltage is higher, because trapping effects become more significant. It is concluded that an acceptor density in the buffer layer should be made low to minimize current slump, although current cutoff behavior may be degraded when the gate length is short.
UR - http://www.scopus.com/inward/record.url?scp=84901319692&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84901319692&partnerID=8YFLogxK
U2 - 10.1007/978-3-211-72861-1_63
DO - 10.1007/978-3-211-72861-1_63
M3 - Conference contribution
AN - SCOPUS:84901319692
SN - 9783211728604
T3 - 2007 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2007
SP - 265
EP - 268
BT - 2007 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2007
PB - Springer-Verlag Wien
T2 - 12th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2007
Y2 - 25 September 2007 through 27 September 2007
ER -