Simulation of reduction properties of radiated emission by on-chip decoupling capacitor

Toshio Sudo; Manabu Bonkohara

doi:10.1109/SPI.2002.258278

Simulation of reduction properties of radiated emission by on-chip decoupling capacitor

Toshio Sudo, Manabu Bonkohara

電気電子情報工学専攻

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

This paper reports simulation results on simultaneous switching noise and radiated emission due to the existence of on-chip decoupling capacitor. Signal overshoots/undershoots was observed for the case of on-chip decoupling capacitor, while signal degradation was observed for the case of without on-chip decoupling capacitor. The behavior of ground bounce for the case of on-chip capacitor was different from the case of without on-chip capacitor. The current flow at the power and ground terminals was used as excitation source of FDTD model with the power/ ground plane. The simulation results were compared with the measurement data.

本文言語	English
ホスト出版物のタイトル	Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI
ページ	15-18
ページ数	4
DOI	https://doi.org/10.1109/SPI.2002.258278
出版ステータス	Published - 2002 12月 1
イベント	6th IEEE Workshop on Signal Propagation on Interconnects, SPI - Pisa, Italy 継続期間: 2002 5月 12 → 2002 5月 15

出版物シリーズ

名前	Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI

Conference

Conference	6th IEEE Workshop on Signal Propagation on Interconnects, SPI
国/地域	Italy
City	Pisa
Period	02/5/12 → 02/5/15

ASJC Scopus subject areas

信号処理
コンピュータネットワークおよび通信

文献へのアクセス

10.1109/SPI.2002.258278

他のファイルとリンク

引用スタイル

Sudo, T & Bonkohara, M 2002, Simulation of reduction properties of radiated emission by on-chip decoupling capacitor. in Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI., 4027643, Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp. 15-18, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, Pisa, Italy, 02/5/12. https://doi.org/10.1109/SPI.2002.258278

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abstract = "This paper reports simulation results on simultaneous switching noise and radiated emission due to the existence of on-chip decoupling capacitor. Signal overshoots/undershoots was observed for the case of on-chip decoupling capacitor, while signal degradation was observed for the case of without on-chip decoupling capacitor. The behavior of ground bounce for the case of on-chip capacitor was different from the case of without on-chip capacitor. The current flow at the power and ground terminals was used as excitation source of FDTD model with the power/ ground plane. The simulation results were compared with the measurement data.",

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N2 - This paper reports simulation results on simultaneous switching noise and radiated emission due to the existence of on-chip decoupling capacitor. Signal overshoots/undershoots was observed for the case of on-chip decoupling capacitor, while signal degradation was observed for the case of without on-chip decoupling capacitor. The behavior of ground bounce for the case of on-chip capacitor was different from the case of without on-chip capacitor. The current flow at the power and ground terminals was used as excitation source of FDTD model with the power/ ground plane. The simulation results were compared with the measurement data.

AB - This paper reports simulation results on simultaneous switching noise and radiated emission due to the existence of on-chip decoupling capacitor. Signal overshoots/undershoots was observed for the case of on-chip decoupling capacitor, while signal degradation was observed for the case of without on-chip decoupling capacitor. The behavior of ground bounce for the case of on-chip capacitor was different from the case of without on-chip capacitor. The current flow at the power and ground terminals was used as excitation source of FDTD model with the power/ ground plane. The simulation results were compared with the measurement data.

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T3 - Proceedings - 6th IEEE Workshop on Signal Propagation on Interconnects, SPI

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Simulation of reduction properties of radiated emission by on-chip decoupling capacitor

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