TY - GEN
T1 - Single-sided Multi-layer Electric Circuit by Hot Stamping with 3D Printer
AU - Imai, Yuhei
AU - Manabe, Hiroyuki
N1 - Funding Information:
This work was supported by JSPS KAKENHI Grant Number 20K19851.
Publisher Copyright:
© 2021 Owner/Author.
PY - 2021/10/10
Y1 - 2021/10/10
N2 - The spread of personal computer-Aided fabrication has made it possible for individuals to create things that meet their personal needs. However, it is still not easy for an individual to prototype electronic circuits. Several methods have been proposed for quickly prototyping electronic circuits. Our solution is combining a 3D printer with transfer foil. This paper expands our original circuit printing method so as to fabricate single-sided multi-layer boards. We show that the proposed technique allows a 3D printer and two types of transfer foil to create single-sided multi-layer circuits.
AB - The spread of personal computer-Aided fabrication has made it possible for individuals to create things that meet their personal needs. However, it is still not easy for an individual to prototype electronic circuits. Several methods have been proposed for quickly prototyping electronic circuits. Our solution is combining a 3D printer with transfer foil. This paper expands our original circuit printing method so as to fabricate single-sided multi-layer boards. We show that the proposed technique allows a 3D printer and two types of transfer foil to create single-sided multi-layer circuits.
KW - 3D printer
KW - Multi-layer electric circuit
KW - hot stamping
KW - silver paste
KW - transfer foil
UR - http://www.scopus.com/inward/record.url?scp=85117952131&partnerID=8YFLogxK
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U2 - 10.1145/3474349.3480200
DO - 10.1145/3474349.3480200
M3 - Conference contribution
AN - SCOPUS:85117952131
T3 - Adjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021
SP - 126
EP - 128
BT - Adjunct Publication of the 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021
PB - Association for Computing Machinery, Inc
T2 - 34th Annual ACM Symposium on User Interface Software and Technology, UIST 2021
Y2 - 10 October 2021 through 14 October 2021
ER -